JunPus International Co., Ltd. is a leading Manufacturer, Supplier and Exporter ofThermal CompoundThermal CompoundsThermal Compound Paste with a factory in Taiwan. We supply and export consistently high class products and continually improve upon the manufacturing processes and work environment through total employee involvement and strict adherence to fair business ethics. We have gained several patents in the field. Our sincerity and hard work has helped us to match our quality with international standards. If you are interested in any styles of our products, please feel free to contact us. 
We are the leading manufacturer, supplier and exporter of which are engineered from the best quality raw material and are acknowledged for their sturdy construction and durable service life. During the manufacturing process, our expert teams checks the quality of the products thus we ensure the superior products to our clients. It is primarily used in the electronics and computer industries to assist a heat sink to draw heat away from a semiconductor component such as an integrated circuit or transistor. In electronics, it is often used to aid a component's thermal dissipation via a heat sink. We are best known for satisfying customers with the efficiency and long last lasting ability of our products.

JunPus

Ceramic Heat Sink | Ceramic HeatSink | LED HeatSink manufacturer supplier from Taiwan wholesaler distributor OEM ODM -Jun Pus International Co., Ltd.
Super User

Super User

Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Junpus thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. 

Features
One year warranty
Programmable Timer 0.01 - 99.99 seconds
Easy teach & learn function
Universal power supply design
Easy Manual / Timer / Cycle functions
Suck-Back feature ensures no dripping
Suitable for all kind of liquid

Features
Digital time / pressure / vacuum display 
Easy teach & learn function
Manual / Timer / Cycle operation Modes
Dispense time from 0.01 - 99.99 seconds 
Suck-Back feature ensures no dripping 
Fast dispense speed at 600 cycles/second 
Stores up to 39 programs

JP-D8000 Made with high-purity thermal conducting materials, JP-D8000exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-D9000 Made with high-purity thermal conducting materials, JP-D9000 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

The ceramic  heat-sink are a JunPus development and offer an effective combination of circuit board and heat-sink for the reliable cooling of thermally sensitive components and circuits. They are excellently suited for thermal management and cooling of high-power LEDs or high-performance circuits in high-power electronics.

Computer Heatsinks: Ceramic Heat Sink,Thermal Heat Sinks Manufacturer, CPU ThermalHeatsinks, Taiwan CPU Heatsinks, Manufacturer,Supplier,Exporter,Factory, distributor - Product OEM ODM

NANO Diamond Thermal Pad

We make available for our clients a top-of-the-line range of NANO Diamond Thermal Pad which is mainly used in electronic devices and heat sinks or product transfer interface between the enclosures. The combination of a tough carrier material such as fiberglass and thermally conductive silicone rubber which is conformable provides the engineer with a more versatile material than mica or ceramics and grease. Our product is known to be a special type of chemical that greatly improves heat transfer as well as the cooling of the processor. The combination of a tough carrier material such as fiberglass and thermally conductive silicone rubber which is conformable provides the engineer with a more versatile material than mica or ceramics and grease. Thermal Pad based on silica gel as a substrate, adding metal oxides and other auxiliary materials, a thermal conductivity of dielectric materials synthesized through a special process. The pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. It is designed to take advantage of the design of the gap transfer heat production, able to fill the gap to complete the heat transfer between the heating part and cooling parts, and also played the role of insulation, cushioning, sealing, etc. It is able to meet the requirements of equipment miniaturization and ultra-thin design, is an excellent thermal conductivity filler material whit highly technology use, and for a wide range of thickness. Our products also have high thermal stability that results in making them perform under severe conditions.

If you have never built a computer there is a fair chance you have no idea what thermal paste is. Also referred to as thermal Grease, thermal compound and “oh really?, I hope that doesn’t stain”. “Thermal Conductivity compound” as JunPus calls it, is the heat conductive material that serves as the physical intermediary between your cooler and your CPU.

 

We are engaged in offering a wide range of Thermal Compounds that are manufactured using state-of-the-art technology and latest machinery. They are silicone fluids based on silicone, adding filler, thermal conductivity materials, and other polymer materials, with good thermal conductivity, electrical insulation, and are widely used in electronic components. Stringently formulated using optimum quality ingredients, these are formulated in accordance with set industry standards. The range will not harden or dry out or melt even after 1000 hours 200℃with good single component modified silicone system suitable for heat sink application. Due to use of cost efficient technology in our assembly unit, we can supply our complete range to the customers at market leading prices. Our expertise allows us to offer a comprehensive range of Thermal Compounds, which is developed in tandem with the international quality standards. Customer satisfaction is of prime importance at this field enterprise and so supreme quality raw materials are used for manufacturing the products. They insulate the hot surface, ensuring energy conservation, protection of operators and providing comfortable work environment. Owing to their features like impeccable quality, easy to use and longer life these are highly appreciated by our clients throughout the world. We devise our range with most modern state of the art facilities and our expertise also allows us to empower them with unmatchable uncompromising quality & outstanding services.

JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology. 

Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its

finer molecular structure produced by nanoscale treatment. 

JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology. 

Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its

finer molecular structure produced by nanoscale treatment.