JunPus International Co., Ltd. is a leading Manufacturer, Supplier and Exporter ofThermal CompoundThermal CompoundsThermal Compound Paste with a factory in Taiwan. We supply and export consistently high class products and continually improve upon the manufacturing processes and work environment through total employee involvement and strict adherence to fair business ethics. We have gained several patents in the field. Our sincerity and hard work has helped us to match our quality with international standards. If you are interested in any styles of our products, please feel free to contact us. 
We are the leading manufacturer, supplier and exporter of which are engineered from the best quality raw material and are acknowledged for their sturdy construction and durable service life. During the manufacturing process, our expert teams checks the quality of the products thus we ensure the superior products to our clients. It is primarily used in the electronics and computer industries to assist a heat sink to draw heat away from a semiconductor component such as an integrated circuit or transistor. In electronics, it is often used to aid a component's thermal dissipation via a heat sink. We are best known for satisfying customers with the efficiency and long last lasting ability of our products.


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Thermal Tap T180

JP-T180 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 
JP-T180 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. 
Heat effect increased significantly. 
JP-T180 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

1.Very good insulator
2.Easy to assembly
3.Good thermal conductivity
4.Ultra soft and high compressibility
5.Natural tack 
Electronic components:IC、CPU、MOS、LED、M/B、P/S、HEAT SINK、LCD-TV、N/B PC、PC、Telecom Device、Wireless Hub etc.
DDR II Module、DVD Applications、Hand-set applications etc.

Test Item Test method Unit JP-T180 value
Color   Visual   gray
Thickness   ASTM D374 Mm 0.5~14.0
Density ASTM D792 g/cc 2.0
Hardness ASTM D2240 Shore 35±5
Tensile Strength    ASTMD412 kg/cm 1.5
Continuous use Temp EN344 -40~+220
Volume Resistivity ASTM D257 Ω-CM 1.5×1011
Breakdown Voltage ASTM D149 KV/mm 4
Thermal impedance ASTM-D5470 in2/W 0.25
Flame Rating UL-94   v-0
Conductivity ASTM D5470 w/m-k 1.8

August 30 2012