JP-Dx1 Made with high-purity thermal conducting materials, JP-Dx1 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment.
This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.
JP-Dx1 Thermally conductive compounds are grease-like products which is formulated with Nano diamond powder and silicone fluids as base oil to provide superior thermal conductivity.
Good performance is obtained when use JP-Dx1 for thermal conductivity of semiconductor devices, such as CPUs, ICs, High Power LED and power transistors.
Application:
Main ingredients:Nanodiamond, silicon
•Major applications:
o Heat sink interface for the high-power chips in power source electronics such as power supply
o Heat sink interface for High Bright LED High Bright LED
o Heat sink interface for CPU in various computers or high-power chips
o Heat sink interface for Graphics Processing Unit (GPU) in different display cards
•This product complies with the RoHS (Restriction of use of hazardous substances) Directive: SGS no.CE/2008/12124
•Thermal Conductivity:16(W/m•K)
Product name |
JP-DX1 |
|
Color Appearance |
Gray |
|
Viscosity(mPa. s) |
3,000,000 |
|
Specific Gravity(g/cm3) |
2.7 |
|
Thermal Conductivity(w/m-K) |
16 MAX |
|
Thermal Resistance (℃*cm2/w)60Psi |
0.05 |
|
Dielectric Constant |
14.5 at 1MHz |
|
Volatile matter(%)120℃@96hrs |
0.18 |
|
Out Gasing(%),200℃@96hrs |
0.01 |
|
Temperature Stability(℃) |
-50 ~ 200 |
|
Shelf Life |
2 years |
Product Features:
•Superior thermal conduction and low thermal resistivity.
•Wide range of applicable temperatures and stable thermal conductivity.
Better Rcontact : advantage II
•Easy to work with, non-caustic, anti-oxidation, not easily solidifying.
Coralloid shape
worse mobility and voids forming
Summary of Diamond Characters
| Diamond(C) | Silver(Ag) | Alumina Nitride(AlN) |
| Insulator | Electrical conductive material Short circuit issue |
Semiconductor Break-down after electric static discharge |
| Extremely good chemical and physical stability resistant to ambient & long term reliability | Catalyst material reliability issue |
1.Slowly dissolve in mineral acids and strong alkalies 2.Slowly hydrolyze in water and oxidize in atmosphere reliability issue |
| Quasi-spherical shap1.smooth mobility 2.surface texture filling ability à less contact resistance |
large flat geometry1.voids bridging2.strong aggregation after stirring | 3-dim irregular shape Strong voids Worse contact resistance |