2015 Exhibition Schedule

Taiwan International Lighting Show
Taipei, Taiwan

03/25~03/28 

Booth No.
Nangang Exhibition Hall M1003

41st Taipei International Electronics Show
Taipei, Taiwan

10/06~10/09

  

Super User

Super User

Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Junpus thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. 

Size:40*40*2.5mm

Material quality : Ceramic

Application:Power IC

Color:Gray

Size:30*30*2.5mm

Material quality : Ceramic

Application:Power IC

Color:Gray

Size:30*30*5mm

Material quality : Ceramic

Application:Power IC

Color:Gray

Size:20*20*2mm

Material quality : Ceramic

Application:Power IC

Color:Gray

Size:10*10*2mm

Material quality : Ceramic

Application:Power IC

Color:Gray

Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Junpus thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions.