JPNS200 are formulated with Synthetic fluids and highly conductive ceramic fillers. These finely engineered compounds provide low bleed and solve the problems of contamination and migration associated with silicone based products.
They offer better stability for a longer life cycle with high thermal conductivity (2 W/m°K) and low thermal resistance (0.014 °C-in2/W).
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By using specialist supplied packaging, we guarantee all supplied components are to the exact mix ratio's. This takes away any guesswork or the effort and time to measure and weight out mixes. All packaged components are supplied in sealed packs with labels displaying health and safety data, material information, fill date and shelf life.
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Features:
1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister
2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet
3) Thickness: according to your requirements and usage
JP-T180 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-T180 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full.
Heat effect increased significantly.
JP-T180 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.