Our secret of success has been our management's policy of adhering to business ethics in its dealing with customers. We assure you of on-time delivery of finest 

Thermal Compounds

 backed by prompted and careful after-sales service.

We are engaged in offering a wide range of Thermal Compounds that are manufactured using state-of-the-art technology and latest machinery. They are silicone fluids based on silicone, adding filler, thermal conductivity materials, and other polymer materials, with good thermal conductivity, electrical insulation, and are widely used in electronic components. Stringently formulated using optimum quality ingredients, these are formulated in accordance with set industry standards. The range will not harden or dry out or melt even after 1000 hours 200℃with good single component modified silicone system suitable for heat sink application. Due to use of cost efficient technology in our assembly unit, we can supply our complete range to the customers at market leading prices. Our expertise allows us to offer a comprehensive range of Thermal Compounds, which is developed in tandem with the international quality standards. Customer satisfaction is of prime importance at this field enterprise and so supreme quality raw materials are used for manufacturing the products. They insulate the hot surface, ensuring energy conservation, protection of operators and providing comfortable work environment. Owing to their features like impeccable quality, easy to use and longer life these are highly appreciated by our clients throughout the world. We devise our range with most modern state of the art facilities and our expertise also allows us to empower them with unmatchable uncompromising quality & outstanding services.

Nano Diamond Thermal Grease DX1 Featured

JP-Dx1 Made with high-purity thermal conducting materials, JP-Dx1 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-Dx1 Made with high-purity thermal conducting materials, JP-Dx1 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-Dx1 Thermally conductive compounds are grease-like products which is formulated with Nano diamond powder and silicone fluids as base oil to provide superior thermal conductivity.

Good performance is obtained when use JP-Dx1 for thermal conductivity of semiconductor devices, such as CPUs, ICs, High Power LED and power transistors.

Application:
Main ingredients:Nanodiamond, silicon
•Major applications:
o Heat sink interface for the high-power chips in power source electronics such as power supply
o Heat sink interface for High Bright LED High Bright LED
o Heat sink interface for CPU in various computers or high-power chips
o Heat sink interface for Graphics Processing Unit (GPU) in different display cards
•This product complies with the RoHS (Restriction of use of hazardous substances) Directive: SGS no.CE/2008/12124
•Thermal Conductivity:16(W/m•K)

Product name

JP-DX1

Color Appearance

Gray

Viscosity(mPa. s)

3,000,000

Specific Gravity(g/cm3)

2.7

Thermal Conductivity(w/m-K)

16 MAX

Thermal Resistance

(*cm2/w)60Psi

0.05

Dielectric Constant

14.5 at 1MHz

Volatile matter(%)120℃@96hrs

0.18

Out Gasing(%),200℃@96hrs

0.01

Temperature Stability()

-50 ~ 200

Shelf Life

2 years

Product Features: 
•Superior thermal conduction and low thermal resistivity.
•Wide range of applicable temperatures and stable thermal conductivity.
Better Rcontact : advantage II
•Easy to work with, non-caustic, anti-oxidation, not easily solidifying.



Coralloid shape
worse mobility and voids forming

Summary of Diamond Characters

 

Diamond(C) Silver(Ag) Alumina Nitride(AlN)
Insulator Electrical conductive material
Short circuit issue
Semiconductor
Break-down after electric static discharge
Extremely good chemical and physical stability resistant to ambient & long term reliability Catalyst material
reliability issue  
1.Slowly dissolve in mineral acids and strong alkalies 2.Slowly hydrolyze in water and oxidize in atmosphere
reliability issue
Quasi-spherical shap1.smooth mobility 2.surface texture filling ability
à less contact resistance
large flat geometry1.voids bridging2.strong aggregation after stirring 3-dim irregular shape Strong voids
Worse contact resistance
March 8 2013

Additional Info