JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.
JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.
JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.
JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.
Manual syringe assemblies
Manual syringe assemblies in sizes from 1ml to 60ml either graduated or unmarked. Select either luer lock tip end (twist on) or luer slip tip end (push on). Syringes are supplied pre-assembled ready for use and can handle most gels, glues, inks, grease, adhesives and other fluids.
Clear syringe barrel assemblies include plastic push rod and rubber wiper piston. Either luer lock or luer slip versions. In sizes 1cc to 60cc. Compatible with most liquids, pastes and adhesives. Low cost solutions for applying liquids.
Features:
1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister
2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet
3) Thickness: according to your requirements and usage
JP-P400 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P400 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-P400 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
JP-P300 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P300 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-P300 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
JP-P230 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P230series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-230 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.