Computer Blister Packing: Thermal Blister Packing Manufacturer, italy CPU Thermal Blister Packing Supplier, Taiwan CPU Thermal Blister Packing,italy, Manufacturer,Supplier,Exporter,Factory, distributor - Product OEM ODM

JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology. 

Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its

finer molecular structure produced by nanoscale treatment. 

 

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