JunPus International Co., Ltd. is a leading Manufacturer, Supplier and Exporter ofThermal CompoundThermal CompoundsThermal Compound Paste with a factory in Taiwan. We supply and export consistently high class products and continually improve upon the manufacturing processes and work environment through total employee involvement and strict adherence to fair business ethics. We have gained several patents in the field. Our sincerity and hard work has helped us to match our quality with international standards. If you are interested in any styles of our products, please feel free to contact us. 
We are the leading manufacturer, supplier and exporter of which are engineered from the best quality raw material and are acknowledged for their sturdy construction and durable service life. During the manufacturing process, our expert teams checks the quality of the products thus we ensure the superior products to our clients. It is primarily used in the electronics and computer industries to assist a heat sink to draw heat away from a semiconductor component such as an integrated circuit or transistor. In electronics, it is often used to aid a component's thermal dissipation via a heat sink. We are best known for satisfying customers with the efficiency and long last lasting ability of our products.

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Nano Diamond Thermal Paste D9000 Featured

JP-D9000 Made with high-purity thermal conducting materials, JP-D9000 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-D9000 Made with high-purity thermal conducting materials, JP-D9000 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-D9000 Thermally conductive compounds are grease-like products which is formulated with Nano diamond powder and silicone fluids as base oil to provide superior thermal conductivity.

Good performance is obtained when use JP-D9000 for thermal conductivity of semiconductor devices, such as CPUs, ICs, High Power LED and power transistors.

Application:
Main ingredients:Nanodiamond, silicon
•Major applications:
o Heat sink interface for the high-power chips in power source electronics such as power supply
o Heat sink interface for High Bright LED High Bright LED
o Heat sink interface for CPU in various computers or high-power chips
o Heat sink interface for Graphics Processing Unit (GPU) in different display cards
•This product complies with the RoHS (Restriction of use of hazardous substances) Directive: SGS no.CE/2008/12124
•Thermal Conductivity:8.9 (W/m•K)

Product Features: 
•Superior thermal conduction and low thermal resistivity.
•Wide range of applicable temperatures and stable thermal conductivity.
Better Rcontact : advantage II
•Easy to work with, non-caustic, anti-oxidation, not easily solidifying.



Coralloid shape
worse mobility and voids forming

Summary of Diamond Characters

Product name

JP-D9000

JP-D8000

JP-DL700

JP-DL600

Color Appearance

Gray

Gray

Gray

Gray

Viscosity(mPa. s)

5,500,000

3,000,000

7000,000

600,000

Specific Gravity(g/cm3)

2.7

2.2

1.9

1.8

Thermal Conductivity(w/m-K)

8.9

5.5

4.5

3

Thermal Resistance

(*cm2/w)60Psi

0.08

0.103

0.147

0.151

Dielectric Constant

14.5 at 1MHz

14.5 at 1MHz

14.5 at 1MHz

14.5 at 1MHz

Volatile matter(%)120@96hrs

0.18

0.24

0.21

0.22

Out Gasing(%),200@96hrs

0.01

0.02

0.01

0.02

Temperature Stability()

-50 ~ 150

-50 ~ 180

-50 ~ 250

-50 ~ 250

Shelf Life

3 years

3 years

3 years

3 years

Diamond(C) Silver(Ag) Alumina Nitride(AlN)
Insulator Electrical conductive material
Short circuit issue
Semiconductor
Break-down after electric static discharge
Extremely good chemical and physical stability resistant to ambient & long term reliability Catalyst material
reliability issue  
1.Slowly dissolve in mineral acids and strong alkalies 2.Slowly hydrolyze in water and oxidize in atmosphere
reliability issue
Quasi-spherical shap1.smooth mobility 2.surface texture filling ability
à less contact resistance
large flat geometry1.voids bridging2.strong aggregation after stirring 3-dim irregular shape Strong voids
Worse contact resistance
March 20 2012

Additional Info