JP-P130 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P130 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-P130 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.