With advanced science and technology, our company develops and manufactures various kinds of 

Thermal Pad

. We will continue to innovate on our technology, management, services and business to meet future challenges and fulfill our responsibilities.

We make available for our clients a top-of-the-line range of Thermal Pad which is mainly used in electronic devices and heat sinks or product transfer interface between the enclosures. The combination of a tough carrier material such as fiberglass and thermally conductive silicone rubber which is conformable provides the engineer with a more versatile material than mica or ceramics and grease. Our product is known to be a special type of chemical that greatly improves heat transfer as well as the cooling of the processor. The combination of a tough carrier material such as fiberglass and thermally conductive silicone rubber which is conformable provides the engineer with a more versatile material than mica or ceramics and grease. Thermal Pad based on silica gel as a substrate, adding metal oxides and other auxiliary materials, a thermal conductivity of dielectric materials synthesized through a special process. The pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. It is designed to take advantage of the design of the gap transfer heat production, able to fill the gap to complete the heat transfer between the heating part and cooling parts, and also played the role of insulation, cushioning, sealing, etc. It is able to meet the requirements of equipment miniaturization and ultra-thin design, is an excellent thermal conductivity filler material whit highly technology use, and for a wide range of thickness. Our products also have high thermal stability that results in making them perform under severe conditions.

Thermal Conductive Pad |Thermal Pad LED Thermal pad manufacturer Thermal Pads supplier from Taiwan wholesaler distributor-Jun Pus International Co., Ltd.
Super User

Super User

Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Junpus thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. 

Features:

1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister

2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet

3) Thickness: according to your requirements and usage 

Features:

1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister

2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet

3) Thickness: according to your requirements and usage 

 By using specialist supplied packaging, we guarantee all supplied components are to the exact mix ratio's. This takes away any guesswork or the effort and time to measure and weight out mixes. All packaged components are supplied in sealed packs with labels displaying health and safety data, material information, fill date and shelf life.

 

JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology. 

Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its

finer molecular structure produced by nanoscale treatment. 

Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Junpus thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. 

Phase Change Materials (PCM) absorbs a large amount of heat in the process of changing from solid to liquid phase and this results in cooling of the surroundings. 

If you are not versed with the subject, you will have to think hard before you give an example of another Phase Change Material. Well, you will say that your breakfast butter is also a Phase Change Material - PCM. This too happens with a lot of heat absorption or release when it changes phase at about 40-45C.

JP-P600 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 
JPP600 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 
JP-P600 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

Thermal Conductivity Graphite
Feature:
1. Pre-Cut for different shape
2. Ultra high thermal conductivity
3. Easy to assembly 

JP-DL600 Made with high-purity thermal conducting materials, JP-DL600exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-D9000 Made with high-purity thermal conducting materials, JP-D9000 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.