JunPus International Co., Ltd. is a leading Manufacturer, Supplier and Exporter ofThermal CompoundThermal CompoundsThermal Compound Paste with a factory in Taiwan. We supply and export consistently high class products and continually improve upon the manufacturing processes and work environment through total employee involvement and strict adherence to fair business ethics. We have gained several patents in the field. Our sincerity and hard work has helped us to match our quality with international standards. If you are interested in any styles of our products, please feel free to contact us. 
We are the leading manufacturer, supplier and exporter of which are engineered from the best quality raw material and are acknowledged for their sturdy construction and durable service life. During the manufacturing process, our expert teams checks the quality of the products thus we ensure the superior products to our clients. It is primarily used in the electronics and computer industries to assist a heat sink to draw heat away from a semiconductor component such as an integrated circuit or transistor. In electronics, it is often used to aid a component's thermal dissipation via a heat sink. We are best known for satisfying customers with the efficiency and long last lasting ability of our products.

JunPus

Ceramic Heat Sink | Ceramic HeatSink | LED HeatSink manufacturer supplier from Taiwan wholesaler distributor OEM ODM -Jun Pus International Co., Ltd.
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Super User

Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Junpus thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. 

JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology. 

Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its

finer molecular structure produced by nanoscale treatment. 

JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology. 

Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its

finer molecular structure produced by nanoscale treatment. 

JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology. 

Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its

finer molecular structure produced by nanoscale treatment. 

JP-P400 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P400 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-P400 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

 

JP-P300 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P300 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-P300 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

 

JP-P230 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P230series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-230 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

 

JP-P130 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P130 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-P130 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

JP-DL800B Made with high-purity thermal conducting materials, JP-DL800B exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-T180 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 
JP-T180 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. 
Heat effect increased significantly. 
JP-T180 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

JPNS200 are formulated with Synthetic fluids and highly conductive ceramic fillers. These finely engineered compounds provide low bleed and solve the problems of contamination and migration associated with silicone based products. 
They offer better stability for a longer life cycle with high thermal conductivity (2 W/m°K) and low thermal resistance (0.014 °C-in2/W).